SOLVING SEMICONDUCTOR PROBE CARD PROBLEMS UTILIZING TRIZ AND DATA ANALYSIS
In accordance with the demand for high-quality / high-performance characteristics of semiconductor products worldwide, highly integrated new products using advanced technologies are being developed and released. In the final stage of FAB (Fabrication, semiconductor production line) in the semiconductor manufacturing process, a probe card is used to test the operation of the semiconductor. This paper addresses the process of analyzing problems and deriving solutions using the TRIZ and 6-Sigma methods for problems that occur when measuring highly integrated products using probe cards in the semiconductor industry. SK Hynix, one of the world's largest semiconductor companies, has several factories in Korea and China. The solution idea, developed at one plant in Korea, is applied at other plants in China. The solution contributed not only to our company, but also to the other probe card manufacturers in the industry.
Kim, Joung Ho, Probe head and card structures for high-speed wafer level testing of application processor (AP) with LPDDR interface, KOASAS(2015).
Ahn, Young-Soo, Hwang, In-Keuk, New Management Innovation Strategy through The Combination of DMAIC and TRIZ, Pages.811-813, The Korea Academia-Industrial cooperation Society(2010).
Yong Won Song, Kyung Mo Kim, Sung Hwan Kim, (Creative Problem Solving Theory) TRIZ, Korea Standards Association Media (2017).
ITFIND Homepage, https://www.itfind.or.kr/COMIN/file50096-MEMS 20Market 20Brief 202010 20VOL 201.pdf.
SK Career Official Blog, https://www.skcareersjournal.com/1203.
Samsung Semi-conductor Story, Homepage, https://www.samsungsemiconstory.com/2111.
Formfactor Homepage, https://www.formfactor.com
- There are currently no refbacks.