APPLICATION OF LASERS IN DECAPSULATION PROCESSES

Vedran HERCEG, Ivan SAMARDŽIĆ, Antun STOIĆ

Abstract


Microchip decapsulation has risen in prominence over the years in the fault analysis branch due to the increase of microelectronic component complexity. As such, a corresponding need for faster and higher quality decapsulation processes emerged. While chemical etching and CNC milling remain as the most widespread processes in professional and enthusiast decapsulation works, the application of lasers
in such tasks is rapidly evolving to become an industry-leading approach to the intricacies of microelectronics fault analyses. This paper presents the fundamentals of decapsulation and explores the potential benefits of laser decapsulation techniques in the field of microchip reuse and bug analysis.


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References


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