STUDY ON THERMAL CONTROL OF TECHNOLOGICAL FLOW IN SURFACE-MOUNT TECHNOLOGY SOLDERING OF ELECTRONIC COMPONENTS

Geza-Mihai ERDODI, Elena MUNCUT (WISZNOVSZKY), Valentin MULLER, Aurel Ion PERIANU

Abstract


The paper presents an industrial application of research on the occurrence of cracks in joints made with Pb (Lead)-free alloys, with an experiment carried out on a printed circuit board type with rigid FR4. FR4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant. The base plate is 1.6 mm thick, plated with a 35 mm thick copper (Cu) layer and a gold (Au) and nickel (Ni) -based finishing layer. The experimental part is a comparative study in the case of shear tests, for 5 samples having joints soldered with alloys containing Pb and 5 samples having joints soldered with alloys without Pb. The study of crack occurrence was based on subjecting the joint to a set of 200 thermal cycles and inducing local stresses by acting on the components and the temperature of the joining alloy in the first case being maximum 2400C. The results are applied industrially on machines for placing components on through-hole boards with wave soldering or Surface-Mount Technology (SMT) assembly machines with soldering in a complex thermal cycle oven: heating in several stages to the soldering temperature and finally cooling.


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References


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