SPECIFIC BEHAVIOUR OF Sn-9Zn LOW FUSION ALLOY USED AS MATERIAL FOR FILAMENT DEDICATED TO FDM PRINTING PROCESS

Ionel Dănuț SAVU, Ines da FONSECA PESTANA ASCENSO PIRES, Sorin Vasile SAVU, Mirela CIORNEI, Dalia SIMION, Adrian Bebe OLEI

Abstract


FDM printing process uses filaments made of polymers. The paper aims to analyze the behaviors of Sn-9Zn low fusion alloy as potential material for elaboration of metallic filaments for FDM process. Sn-9Zn has low melting point, which is below the maximum temperature reached by all common FDM printers. No alterations of the heater component of a printer are required when replace the polymeric filaments with Sn-9Zn filament. Different from ABS and PLA, Sn-9Zn is softer and has lower stiffness. Lower stiffness proved to involve difficulties in the transfer of the filament from the spool to the hot-end. Inside the hot-end the material is very fluid and, due to its transfer speed, the filament fills the heating chamber and the nozzle. That creates a resistance to the transfer process and the filament suffers deformation and even blockages. Specific correlation of the nozzle diameter with the heating temperature and the transfer speed was considered. Increasing of the nozzle diameter from 0.4 to 1.8 mm was necessary to maintain appropriate flow of the molten metal. Filament continued to experience deformations during transfer, but the transfer became possible.


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References


Campbell I, Bourell D, Gibson I (2012) Additive manufacturing: rapid prototyping comes of age. Rapid Prototyp J 18:225–258

Monzón, M. D., et.al., Standardization in additive manufacturing: activities carried out by international organizations and projects, Int J Adv Manuf Technol (2015) 76: 1111. https://doi.org/10.1007/s00170-014-6334-1

Durgun I., Ertan R., Experimental investigation of FDM process for improvement of mechanical properties and production cost, Rapid Prototyping Journal 20.3, 2014, pp. 228–235

Shahrubudin, N., Lee, T.C., Ramlan, R., An Overview on 3D Printing Technology: Technological, Materials, and Applications, Procedia Manufacturing 35 (2019) 1286–1296

Savu, I.D., Savu, S.V., Simion, D., Sîrbu, A.N., Ciornei, M., Rațiu. S.A., PP in 3D Printing – Technical and Economic Aspects, Materiale Plastice, 56, no. 4, 2019, pp 931-936

Turner B. N., Strong R., Gold S. A., A review of melt extrusion additive manufacturing processes: I. Process design and modeling, Rapid Prototyping Journal 20.3, 2014, pp. 192–204

Berger A., Sharon Y., Ashkenazi D., Stern A., Test artifact for additive manufacturing technology: FDM and SLM preliminary results, The Annals of “Dunarea De Jos” University of Galati Fascicle XII, Welding Equipment and Technology 27, 2016, pp. 29–37

Finnes, T., High-Definition 3D Printing – Comparing SLA and FDM Printing Technologies, The Journal of Undergraduate Research: Vol. 13, Article 3. Available at: http://openprairie.sdstate.edu/jur/vol13/iss1/3, 2015

Savu S. V., Savu I. D., Benga G. C., Ciupitu I., Improving functionality of Ti6Al4V by laser technology surfacing, Optoelectronics and Advanced Materials, Rapid Communications, 2016

Aindow, J., Yu, H., Bellinger, M.A., Aindow, M., Eutectic Solidification in Zn-Sn Binary Alloys: An Experiment for High Schools, Microsc. Microanal. 23 (Suppl 1), 2304-2305, 2017, doi:10.1017/S14319276 17012181

Okamoto, H., Schlesinger, M.E., Mueller, E.M. (Editors), ASM Handbook Vol. 3: Alloy Phase Diagrams, ISBN: 978-1-62708-070-5

Savu, S.V., Savu, I.D., Influence of the ultrasonic activation on the wetting process and on the Ag3Sn needles evolution in the soldering process of copper by using Sn-Ag3.5% solder, U.P.B. Sci. Bull., Series B, Vol.81,Iss.2,2019, ISSN1454-2331, 155-170

Savu, S.V., Savu, I.D., Intermetallic behaviour in ultrasonic activation of the Sn-Ag-Cu solder during eutectic soldering process, U.P.B. Sci. Bull., Series B, Vol. 80, Iss., 2, 2018, ISSN 1454-2331, 193-212

Gancarz, T., Physical, Thermal, Mechanical Properties, and Microstructural Characterization of Sn-9Zn-XGa Alloys, Metallurgical and materials transactions, vol. 46A, 2016

Hammam, M., Allah, F.S., Gouda, E.S., Gendy, Y.E., Aziz, H.A., Structure and Properties of Sn9Zn Lead-Free Solder Alloy with Heat Treatment, Engineering, 2010, 2, 172-178, 2010

Lee, J.E., Kim, K.S., Suganuma, K., Inoue, M., Izuta, G., Thermal Properties and Phase Stability of Zn-Sn and Zn-In Alloys as High Temperature Lead-Free Solder, Materials Transactions, Vol. 48, No. 3, 584-593, 2007

Ren, G., Collins, M.N., Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys, Metals, 9, 462; 2019

Nguyen, T.T., Yu, D., Park, S.B., Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation, Journal of Electronic Materials, Vol. 40, No. 6, 2011

Liao, Y., et.al., Effect of Porosity and Crystallinity on 3D Printed PLA Properties, Polymers 2019, 11(9), 1487

Tarnita, D., Berceanu, C., Tarnita, C., The three-dimensional printing–a modern technology used for biomedical prototypes, Materiale plastice, no.47, nr.3, pp 328-334, 2010,


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