DESTRUCTIVE EXAMINATION OF SOLDER JOINTS ON AN SMT MANUFACTURING LINE

Elena MUNCUT (WISZNOVSZKY), Aurel Ion PERIANU, Valentin MULLER, Geza-Mihai ERDODI

Abstract


The paper describes a line for soldering electronic components on PCBs and a method for optimizing solder joint parameters by destructive methods. A microscopic metallographic analysis, a tensile and bending tests and 3D simulations of mechanical tests are also performed. Finally, a method for determining dimensional non-conformities on the PCB manufacturing line by the SMT method is described.

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References


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