RELIABILITY OF BATTERY MANAGEMENT SYSTEM MODULE UNDER SIMULTANEOUS EXPOSURE TO HIGH TEMPERATURE AND RANDOM VIBRATIONS

Florindo-Iuliu PORGE, Veronica ARGEȘANU, Ioan-Marius KIFA

Abstract


In this paper, the impact of mechanical vibrations on the components of an electric vehicle is studied. Even if electric motors generate smaller vibrations than internal combustion engines, vibrations due to the external environment appear on the vehicle, which have a major impact on the reliability of the components. Any type of vibration that over time affects the operation of the components in a vehicle has a direct impact on the comfort and ergonomics of the driver and passengers in the vehicle. The purpose of the paper is to subject a PCB board to a vibration test to show what the permissible limit of vibrations up to which the structure of the board is not affected and implicitly its functionality.


Full Text:

PDF

References


Lall, P., Yadav, V., Locker, D., Sustained high-temperature vibration reliability of thermally aged leadfree assemblies in automotive environments, In 2020 Pan Pacific Microelectronics Symposium (Pan Pacific) (pp. 1-18). IEEE. 2020.

Basaran, C., Chandaroy, R., Thermomechanical analysis of solder joints under thermal and vibrational loading. J. Electron. Packag., 124(1), 60-66. 2002.

Barker, J. Vodzak, A. Dasgupta, M. Pecht, Combined vibrational and thermal solder joint fatigue a generalized strain versus life approach, ASME J. Electron. Package vol. 112(2), pp. 129–134, 1990.

Al-Yafawi, A., Patil, S., Yu, D., Park, S., Pitarresi, J., Goo, N., Random vibration test for electronic assemblies’ fatigue life estimation, In 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (pp. 1-7). IEEE, 2010.

Wong, T., Kachatorian, A., Cohen, M., J-Lead Solder Thermal Fatigue Life Model, ASME International Mechanical Engineering Congress & Exposition, Dallas, Texas, Nov. 1997.

Pitarresi, J. M., Modeling of printed circuit cards subject to vibration, In IEEE international symposium on circuits and systems (pp. 2104-2107). IEEE, 1999.

Pitarresi, J. M., Celetka, D., Coldwel, R., Smith, D., The smeared properties approach to FE vibration modeling of printed circuit cards, ASME Journal of Electronics Packaging, 113(3), 250-257, 1991.

Pitarresi, J. M., Akanda, A., Random vibration response of a surface mount lead/solder joint, Advances in electronic packaging, 4(1), 1993.

Lall, P., Shantaram, S., Suhling, J., Locker, D., Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys, In 2013 IEEE 63rd Electronic Components and Technology Conference (pp. 1277-1293). IEEE, 2013.

Lall, P., Yadav, V., Zhang, D., Suhling, J., Effect of alloy composition and aging on the survivability of leadfree solders in high temperature vibration in automotive environments, In International Electronic Packaging Technical Conference and Exhibition (Vol. 58097, p. V001T01A017). American Society of Mechanical Engineers, 2017.

https://en.wikipedia.org/wiki/IEC_60068

https://cdn.standards.iteh.ai/samples/702/7fdf248fa8414 d5ebf6ef38068f63646/IEC-60068-2-14-2009.pdf

.https://cdn.standards.iteh.ai/samples/23817/6c23bbe60f 7340d8bb148d794ef3f40c/IEC-60068-2-64-2008-AMD1-2019.pdf

.https://rms testsystems.de/electrodynamic-vibration-test-systems-motion-simulator-2/electrodynamic-vibration-test-systems-shaker/electrodynamic-vibration-test-system-up-to-45kn-water-cooled/?lang=en

.https://www.weiss-technik.com/environmental-simulation /en/products/detail/shakeevent-environmental-test-chamber-for-vibration-testing~p3843


Refbacks

  • There are currently no refbacks.


JOURNAL INDEXED IN :