RESEARCH REGARDING PROTOTYPE OF AN ELECTRONIC HYBRID POLYMER STRUCTURE
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Bartlomiej P, Liubomir B, Marcin S, 3D Printed Electronic Circuits from Fusible Alloys, Electronics 2022, 11, 3829
Berman, B. 3-D Printing: The New Industrial Revolution. Bus. Horiz. 2012, 55, 155–162.
J-T. Mäkinen, K. Keränen, T. Alajoki, M. Koponen, A. Keränen, A. Kemppainen and K. Rönkä, Over-molded electronics and printed hybrid systems, SMTA Microelectronic Symposium, Kona, 18-20 January, THA3/1, 2011.
J. van den Brand, J. de Baets, T. van Mol, A. Dietzel, System-in-foil – Device, fabrication processes and reliability issues, Microelectronics Reliability, 27 June 2008, 1123-1128
OPRAN Constantin Gheorghe; 2016; Tehnologii de injecție în matriță produse polimerice; Editura Bren; Bucuresti, Romania; ISBN 978-606-610-201-8; pp.252.
OPRAN Constantin Gheorghe; 2017; Tehnologia produselor din materiale avansate, Indrumar laborator; Editura BREN; București,Romania; ISBN 978-606-610-097-8; pp.158
T. Alajoki, M. Tuomikoski, M. Koponen, M. Heikkinen, J. Vehmas, K. Rönkä, A. Maaninen, Embedding Flexible OLEDs into Polymer Products by Injection Overmoulding Process, Plastic Electronic Conference, Dresden, Germany, October 19-21th, 2010.
Teemu A, Matti K, Markus T, a.o, Hybrid In-Mould Integration for Novel Electrical and Optical Features in 3D Plastic Products, Electronic System-integration Technology Conference (TSC), 2012 4th, September 2012, DOI http://dx.doi.org/10.1109/ ESTC.2012.6542129
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