DEFECT DETECTION SYSTEM DEVELOPMENT SPECIFIC TO ELECTRONIC COMPONENT PLACEMENT

Andrei-Cătălin IOANA, Adela-Eliza DUMITRAȘCU

Abstract


This paper presents the design of an innovative device for placing electronic components on printed circuit boards (PCBs), which integrates an intelligent real-time defect detection system. The proposed solution combines classic pick-and-place technologies with 3D scanning and artificial intelligence algorithms, aiming to automatically identify positioning, orientation, or missing component defects immediately after placement. Using artificial vision and machine learning methods, the system enables continuous process analysis, adjustment of placement parameters, and transmission of relevant information to operators in real time. The implementation of this concept leads to reduced waste, increased quality of finished products, and optimized production costs. The project aligns with Industry 4.0 principles, contributing to the development of intelligent, adaptive, and reliable production systems.

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References


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